ABOUT US

If you have any questions or inquiries, please feel free to get in touch with us. Our team is committed to delivering prompt responses and providing you with the highest level of service and support.

Why choose Us

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Founded in 2011 in Shenzhen, Guangdong, Shenzhen Benlida Circuit Co., Ltd. specializes in the manufacturing of mid-to-high-end printed circuit boards (PCBs). We focus on fast-turn production and provide one-stop manufacturing services ranging from R&D prototypes to small and medium batch orders.

With headquarters in Shenzhen and service centers across East and South China, we have delivered rapid electronic manufacturing services to more than 1,000 customers worldwide. Our goal is to provide faster turnaround at competitive costs while maintaining high product quality.

Backed by an experienced team and years of industry expertise, we have built an efficient manufacturing platform dedicated to quick delivery of PCB samples and small-to-medium batch production. Our products are widely used in industrial control, power electronics, medical devices, automotive systems, security equipment, and computers.

Our main products include high-layer-count precision PCBs, blind and buried via boards, high-frequency and high-speed boards, hybrid laminate boards, and rigid-flex PCBs. We also offer advanced processes such as thick copper, resin plugging, metallized half-holes, stepped slots, and countersunk holes, and support new process development to meet customers’ customized design requirements.

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Development History

BenlidaPCBA Founded

BenlidaPCBA was founded, specializing in quick-turn 2-layer and multilayer PCB prototyping.

2011

Established a standardized DFM

Established a standardized DFM engineering review and fast-delivery workflow, serving industrial control customers.

2012

Deployed AOI

Deployed AOI and 100% electrical testing, strengthening quality traceability across production.

2013

Certified to ISO 9001

Certified to ISO 9001, formalizing process control and inspection standards.

2014

HDI (blind & buried via) capability

Launched HDI (blind & buried via) capability to support higher-density designs.

2015-2018

Expanded production capacity

UL / RoHS / REACH, certified ISO 14001, expanded into high-frequency, high-Tg, and heavy-copper PCBs.

2019-2026

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